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dc.contributor.author박성주-
dc.date.accessioned2023-08-22T01:34:29Z-
dc.date.available2023-08-22T01:34:29Z-
dc.date.issued2014-06-
dc.identifier.citationJOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v. 14, NO. 3, Page. 345-355-
dc.identifier.issn1598-1657;2233-4866-
dc.identifier.urihttps://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE02501183&language=ko_KR&hasTopBanner=trueen_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/185642-
dc.description.abstractToday's System-on-a-Chip (SoC) is designed with reusable IP cores to meet short time-to-market requirements. However, the increasing cost of testing becomes a big burden in manufacturing a highly integrated SoC. In this paper, an efficient parallel scan test technique is introduced to minimize the test application time. Multiple scan enable signals are adopted to implement scan architecture to achieve optimal test application time for the test patterns scheduled for concurrent scan test. Experimental results show that testing times are considerably reduced with little area overhead.-
dc.description.sponsorshipThis research was supported in part by the National Research Foundation of Korea (NRF) grant (MEST) ( No. NRF-2013R1A1A2059326).-
dc.languageen-
dc.publisherIEEK PUBLICATION CENTER-
dc.subjectAMBA-
dc.subjectsystem-on-a-chip-
dc.subjectscan test-
dc.subjectIEEE 1500-
dc.subjectparallel test-
dc.subjecttest time-
dc.titleEfficient Parallel Scan Test Technique for Cores on AMBA-based SoC-
dc.typeArticle-
dc.relation.no3-
dc.relation.volume14-
dc.identifier.doi10.5573/JSTS.2014.14.3.345-
dc.relation.page345-355-
dc.relation.journalJOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE-
dc.contributor.googleauthorSong, Jaehoon-
dc.contributor.googleauthorJung, Jihun-
dc.contributor.googleauthorKim, Dooyoung-
dc.contributor.googleauthorPark, Sungju-
dc.sector.campusE-
dc.sector.daehak소프트웨어융합대학-
dc.sector.department소프트웨어학부-
dc.identifier.pidpaksj-
Appears in Collections:
COLLEGE OF COMPUTING[E](소프트웨어융합대학) > COMPUTER SCIENCE(소프트웨어학부) > Articles
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