Fabrication and Ink-Jet Patterning of Copper Nanoparticles with Improved Dispersion Stability
- Title
- Fabrication and Ink-Jet Patterning of Copper Nanoparticles with Improved Dispersion Stability
- Author
- 오제훈
- Keywords
- Ink-Jet Printing; Cu Nanoparticles; Conductive Ink; Electrochemical Reaction
- Issue Date
- 2010-05
- Publisher
- American Scientific Publishers
- Citation
- Journal of Nanoscience and Nanotechnology, v. 10, NO. 5, Page. 3350-3353
- Abstract
- Copper (Cu) nanoparticles as the metal nanoparticles in the conductive ink were synthesized using electrochemical reaction. This method is characterized as the synthesis process without any metal salts and the post-treatment of washing and drying. It means that it does not need to consider about oxidized and agglomerated metal nanoparticles during the extra treatments. The Cu nanoparticles were synthesized in the various conditions of electrolyte to investigate the mechanism of the synthesis reaction of Cu nanoparticles. And also, the synthesized Cu nanoparticles were controlled the dispersion stability with the addition of dispersion agent such as PVP and Dextran. Finally, it was achieved the ink-jet printed Cu patterns using the synthesized Cu nanoparticles, and examined the morphology of the patterns.
- URI
- https://www.ingentaconnect.com/content/asp/jnn/2010/00000010/00000005/art00070https://repository.hanyang.ac.kr/handle/20.500.11754/183683
- ISSN
- 1533-4880;1533-4899
- DOI
- 10.1166/jnn.2010.2307
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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