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Selection of the optimal interleaving distance for memories suffering MCUs

Title
Selection of the optimal interleaving distance for memories suffering MCUs
Author
백상현
Keywords
Radiation effects; Complex designs; Soft error; Memory; Multiple cell upset; Interleaving distance; Error correction codes; Error correction; Memory reliability; MCU; Optimization
Issue Date
2009-09
Publisher
IEEE
Citation
10th European Conference on Radiation Effects on Components and Systems, Page. 1- 4
Abstract
As technology shrinks, Multiple Cell Upsets (MCU) are becoming a more prominent effect with a large impact on memory reliability. To protect memories from MCUs, single error correction codes (SEC) and interleaving are commonly used. The interleaving distance (ID) is selected such that all errors in an MCU occur on different logical words. This is achieved by using interleaving distances that are larger than the largest expected MCU. However, the use of a large interleaving distance usually results in an area increase and a more complex design. In this paper, the selection of the optimal interleaving distance is explored, minimizing area and complexity without compromising memory reliability. © 2009 IEEE.
URI
https://ieeexplore.ieee.org/document/5994704https://repository.hanyang.ac.kr/handle/20.500.11754/183632
DOI
10.1109/RADECS.2009.5994704
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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