Sintering Mechanism of Vapor Self-Assembled Multilayer (VSAM) Coated Cu Nano Particles for Application in Cu Nano Ink
- Title
- Sintering Mechanism of Vapor Self-Assembled Multilayer (VSAM) Coated Cu Nano Particles for Application in Cu Nano Ink
- Author
- 이선영
- Keywords
- octanethiol; Cu nanoparticle; prevent oxidation; octanol; VSAM
- Issue Date
- 2011-09
- Publisher
- 대한금속·재료학회
- Citation
- Electronic Materials Letters, v. 7, NO. 3, Page. 195-199
- Abstract
- Oxidation preventive Cu nano ink was prepared using a vapor self-assembly multi-layer coating method (VSAMs). These particles were prepared using 100 nm Cu nano particles coated with 1-octanethiol under an ultrahigh vacuum condition with octanol used as a solvent. Octanol-based non-oxidized 10% (wt.) nano ink was well-dispersed without any surfactant. The conductive ink had good dispersion and remains stable for more than weeks. It also has a low viscosity rating of 8.3 cPs. In addition, 5 μL of copper nano ink was dropped into a 1 cm x 1 cm glass substrate to form a copper pattern. The copper pattern was then sintered at 350°C in a tube furnace in a H2 gas atmosphere. The resistivity of the film using the fabricated ink was determined to be 5.8 × 10^(−6) Ωcm. The results show that the non-oxidized oxidation-preventive copper nano ink is suitable for ink-jet printing.
- URI
- https://link.springer.com/article/10.1007%2Fs13391-011-0903-3https://repository.hanyang.ac.kr/handle/20.500.11754/181520
- ISSN
- 1738-8090;2093-6788
- DOI
- 10.1007/s13391-011-0903-3
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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