Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2023-05-24T02:08:31Z | - |
dc.date.available | 2023-05-24T02:08:31Z | - |
dc.date.issued | 2007-10 | - |
dc.identifier.citation | ECS Transactions, v. 11, NO. 2, Page. 419-430 | - |
dc.identifier.issn | 1938-5862;1938-6737 | - |
dc.identifier.uri | https://iopscience.iop.org/article/10.1149/1.2779406 | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/181274 | - |
dc.description.abstract | Defects due to CMP processes should be removed for next processing step. The zeta potential of slurry particle and substrate has been considered to be a critical factor in terms of particle adhesion and removal The fundamental research such as the calculation interaction force based on DLVO theory and the measurement of adhesion forces by AFM between slurry particle and wafer surfaces can enhance the understanding of cleaning mechanism and development of cleaning process. This paper gives an overview of post CMP cleaning process from fundamentals to the current and future. © The Electrochemical Society. | - |
dc.description.sponsorship | This work is supported by the Medium-term Strategic Technology Development Program and Korea Institute of Industrial Technology Evaluation and Planning funded by the Ministry of Commerce, Industry and Energy (MOICE), the fostering project of the Lab of Excellency, post BK21 program and Samsung Electronics. | - |
dc.language | en | - |
dc.publisher | Electrochemical Society, Inc. | - |
dc.title | Surface preparation in CMP process | - |
dc.title | post CMP cleaning and defects | - |
dc.type | Article | - |
dc.relation.no | 2 | - |
dc.relation.volume | 11 | - |
dc.identifier.doi | 10.1149/1.2779406 | - |
dc.relation.page | 419-430 | - |
dc.relation.journal | ECS Transactions | - |
dc.contributor.googleauthor | Park, Jin-Goo | - |
dc.contributor.googleauthor | Kim, Tae Gon | - |
dc.sector.campus | E | - |
dc.sector.daehak | 공학대학 | - |
dc.sector.department | 재료화학공학과 | - |
dc.identifier.pid | jgpark | - |
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