Fabrication of Large-Area CoNi Mold for Nanoimprint Lithography
- Title
- Fabrication of Large-Area CoNi Mold for Nanoimprint Lithography
- Author
- 유봉영
- Keywords
- STAMPS; SELF-ASSEMBLED MONOLAYERS; ANTI-STICTION; ALLOYS; CHLORIDE BATHS; MEMS; NI; ELECTRODEPOSITION; ELECTROLYTES; MORPHOLOGY
- Issue Date
- 2012-02
- Publisher
- IOP Publishing Ltd
- Citation
- Japanese Journal of Applied Physics, v. 51, NO. 2, article no. 026503, Page. 1-5
- Abstract
- A cobalt-nickel (CoNi) alloy stamp of 140 mm diameter and 300 mu m thickness was fabricated for nanoimprint lithography (NIL) from a Si mother mold with nanofeatures by using a stress-free electroforming method. CoNi alloys were electrodeposited in a chloride bath, and the effect of the flow velocity of a plating solution on CoNi film stress was investigated. The compositions of CoNi alloy films were investigated by changing the flow rate and bath concentration of CoCl2. The stress of the CoNi deposit was reduced to almost zero in an electrolyte containing 0.008 M CoCl2 in the flow rate range of 1-2 m/s. The multiple duplication of a stress-free CoNi alloy stamp was carried out without the use of a costly Si mother mold. Duplicated patterns on the CoNi alloy stamp were compared with those of the Si mother mold by field emission scanning electron microscopy (FE-SEM) and atomic force microscopy (AFM). (c) 2012 The Japan Society of Applied Physics
- URI
- https://iopscience.iop.org/article/10.1143/JJAP.51.026503https://repository.hanyang.ac.kr/handle/20.500.11754/180959
- ISSN
- 0021-4922;1347-4065
- DOI
- 10.1143/JJAP.51.026503
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
- Files in This Item:
There are no files associated with this item.
- Export
- RIS (EndNote)
- XLS (Excel)
- XML