Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process
- Title
- Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process
- Author
- 박진구
- Keywords
- PVA Brush loading; Ceria removal; Oxide Post-CMP Cleaning; Zeta-potential
- Issue Date
- 2021-02
- Publisher
- Scientific.net
- Citation
- Solid State Phenomena, v. 314, Page. 259-263
- Abstract
- Brush scrubbing is a well-known post CMP cleaning process. Interaction between PVA
brush and the particles removed during the process must be considered while designing a cleaning
process. In this work, the effect of cleaning solution pH was investigated in terms of particle removal
from the wafer and subsequent loading to the PVA brush nodule. Higher cleaning of particles from
wafer was observed for pH 2 and 12 cleaning solutions and poor cleaning for pH 7 cleaning solution.
In contrast, the brushes were loaded heavily for pH 7 compared to pH 2 and 12. Higher electrostatic
attraction between oppositely charged PVA and ceria surfaces provided higher ceria particles loading
to PVA brush in acidic and neutral cleaning solutions. This particle loading to PVA brush can further
effect cleaning efficiency as well as cross-contamination.
- URI
- https://www.scientific.net/SSP.314.259https://repository.hanyang.ac.kr/handle/20.500.11754/171889
- ISSN
- 1662-9779
- DOI
- 10.4028/www.scientific.net/SSP.314.259
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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