Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2022-05-05T23:29:22Z | - |
dc.date.available | 2022-05-05T23:29:22Z | - |
dc.date.issued | 2021-09 | - |
dc.identifier.citation | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v. 10, NO 9, Page. 1-7 | en_US |
dc.identifier.issn | 21628769 | - |
dc.identifier.issn | 21628777 | - |
dc.identifier.uri | https://iopscience.iop.org/article/10.1149/2162-8777/ac26d3 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/170583 | - |
dc.description.abstract | The effects of H2O2 on the chemical etching and removal rate (RR) of molybdenum (Mo) were investigated. Static etch rate (SER) and chemical mechanical planarization (CMP) experiments were performed using H2O2-based slurries at different pH levels. X-ray photoelectron spectroscopy (XPS) and potentiodynamic polarization analysis showed the formation of Mo oxides by the reaction between Mo and H2O2. The Mo SER, which increased with H2O2 concentration, supported the dissolution of Mo oxides through the formation of peroxo Mo complexes with H2O2. The CMP removal mechanism was demonstrated by comparing the CMP RR with and without silica abrasives. In addition, the Mo oxidation rate by H2O2 on a millisecond time scale was characterized with chronoamperometry to explain different RRs at pH values ranging from 2 to 8. The CMP RR of Mo was high at pH 2 and pH 10; however, pH 2 showed a lower SER than pH 10, leading to lower surface roughness. | en_US |
dc.description.sponsorship | This research was supported by the MOTIE (Ministry of Trade, Industry, and Energy) in Korea, under the Fostering Global Talents for Innovative Growth Program (P0008745) supervised by the Korea Institute for Advancement of Technology (KIAT). | en_US |
dc.language.iso | en | en_US |
dc.publisher | ELECTROCHEMICAL SOC INC | en_US |
dc.subject | molybdenum | en_US |
dc.subject | CMP | en_US |
dc.subject | hydrogen peroxide | en_US |
dc.subject | chronoamperometry | en_US |
dc.title | Effects of H2O2 and pH on the Chemical Mechanical Planarization of Molybdenum | en_US |
dc.type | Article | en_US |
dc.relation.no | 9 | - |
dc.relation.volume | 10 | - |
dc.identifier.doi | 10.1149/2162-8777/ac26d3 | - |
dc.relation.page | 1-7 | - |
dc.relation.journal | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | - |
dc.contributor.googleauthor | Ryu, Heon-Yul | - |
dc.contributor.googleauthor | Teugels, Lieve | - |
dc.contributor.googleauthor | Devriendt, Katia | - |
dc.contributor.googleauthor | Struyf, Herbert | - |
dc.contributor.googleauthor | Kim, Tae-Gon | - |
dc.contributor.googleauthor | Park, Jin-Goo | - |
dc.relation.code | 2021007069 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING | - |
dc.identifier.pid | jgpark | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.