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dc.contributor.author백상현-
dc.date.accessioned2022-04-24T23:57:14Z-
dc.date.available2022-04-24T23:57:14Z-
dc.date.issued2021-10-
dc.identifier.citationIEEE ACCESS, v. 9, Page. 137514-137523en_US
dc.identifier.issn2169-3536-
dc.identifier.urihttps://ieeexplore.ieee.org/document/9558843-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/170257-
dc.description.abstractThe methodological approach of hammering multiple rows is newly proposed to evaluate today's SDRAMs, employed with in-DRAM mitigation circuits. The multiple rows are selected based on the one-row hammering test (single row hammering without refresh commands) and are exploited to defeat the employed mitigation algorithm. We irradiated the target sample using an X-ray to observe the reactions of the mitigation circuit when various combinations of multiple rows are hammered. The results showed a four times reduction in the number of hammering thresholds under the one-row hammering test. The same radiated sample showed no errors when one or a few rows were hammered due to the built-in mitigation circuit. However, multiple rows hammering (MRH) demonstrated its effectiveness by generating errors despite an active mitigation circuit. In this paper, we explore the X-ray damage results in the aging of the DRAM sample and induces vulnerabilities from the row hammering error perspective. Also, we use the error bits detected by MRH to investigate the coverage pitfalls of the mitigation circuit employed in the sample DRAM. Finally, we newly evaluate the remaining retention time under row hammering stress to explain the coverage loss in the mitigation strategy based solely on hammering counts.en_US
dc.description.sponsorshipThe authors would like to thank Yousef Iskander at Cisco Systems, Inc. for his discussions from system security perspectives.en_US
dc.language.isoenen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.subjectAerospaceen_US
dc.subjectBioengineeringen_US
dc.subjectCommunication, Networking and Broadcast Technologiesen_US
dc.subjectComponents, Circuits, Devices and Systemsen_US
dc.subjectComputing and Processingen_US
dc.subjectEngineered Materials, Dielectrics and Plasmasen_US
dc.subjectEngineering Professionen_US
dc.subjectFields, Waves and Electromagneticsen_US
dc.subjectGeneral Topics for Engineersen_US
dc.subjectGeoscienceen_US
dc.subjectNuclear Engineeringen_US
dc.subjectPhotonics and Electroopticsen_US
dc.subjectPower, Energy and Industry Applicationsen_US
dc.subjectRobotics and Control Systemsen_US
dc.subjectSignal Processing and Analysisen_US
dc.subjectTransportationen_US
dc.subjectRandom access memoryen_US
dc.subjectRadiation effectsen_US
dc.subjectDegradationen_US
dc.subjectStressen_US
dc.subjectField programmable gate arraysen_US
dc.subjectTemperature controlen_US
dc.subjectSiliconen_US
dc.subjectDDR3L SDRAMen_US
dc.subjectDDR4 SDRAMen_US
dc.subjectdata retentionen_US
dc.subjectmultiple rows hammeringen_US
dc.subjectone-row hammeringen_US
dc.subjectX-raysen_US
dc.titleExploitations of Multiple Rows Hammering and Retention Time Interactions in DRAM Using X-Ray Radiationen_US
dc.typeArticleen_US
dc.relation.volume9-
dc.identifier.doi10.1109/ACCESS.2021.3117601-
dc.relation.page137514-137523-
dc.relation.journalIEEE ACCESS-
dc.contributor.googleauthorYun, Donghyuk-
dc.contributor.googleauthorPark, Myungsang-
dc.contributor.googleauthorBak, Geunyong-
dc.contributor.googleauthorBaeg, Sanghyeon-
dc.contributor.googleauthorWen, Shi-Jie-
dc.relation.code2021000011-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentSCHOOL OF ELECTRICAL ENGINEERING-
dc.identifier.pidbau-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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