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Biocompatible Cost-Effective Electrophysiological Monitoring with Oxidation-Free Cu-Au Core-Shell Nanowire

Title
Biocompatible Cost-Effective Electrophysiological Monitoring with Oxidation-Free Cu-Au Core-Shell Nanowire
Author
홍석준
Keywords
copper nanowires; core–shell nanowires; Cu–Au nanowires; electrocardiography sensors; electromyogram sensors; ligand exchange; wearable electronics
Issue Date
2020-10
Publisher
WILEY
Citation
ADVANCED MATERIALS TECHNOLOGIES, v. 5, no. 12, Article no. 2000661, 8pp
Abstract
In spite of its excellent electrical, mechanical, and low-cost characteristics, copper nanowire has fatal issues in the oxidation problem and the lack of biological compatibility, which occasionally outweighs its advantages and limits its usage as electronics or biodevice applications. In this study, a novel wet chemical synthesis method is developed for the oxidation-free Cu-Au core-shell nanowire based on the prepared Cu nanowire with alkylamine-mediated synthesis and ligand exchange. The synthesized Cu-Au core-shell nanowire exhibits improved electrical stability against thermal oxidation under the harsh environment of 80 degrees C and 80% relative humidity. Additionally, to substantiate suitability for the biomedical application, the enhanced chemical stability and biocompatibility are investigated by utilizing the artificial perspiration and the cell culture. As a proof-of-concept demonstration, high performance wearable electromyogram (EMG), electrocardiogram (ECG) sensors for electrophysiological monitoring with the Cu-Au core-shell nanowire electrode are demonstrated with superior oxidation-resistance and biocompatibility even after the harsh environment test. The Cu-Au core-shell nanowire can provide promising, cost-effective electrode materials for various wearable electronics applications.
URI
https://onlinelibrary.wiley.com/doi/full/10.1002/admt.202000661https://repository.hanyang.ac.kr/handle/20.500.11754/165288
ISSN
2365-709X
DOI
10.1002/admt.202000661
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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