Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 좌용호 | - |
dc.date.accessioned | 2021-09-09T04:57:47Z | - |
dc.date.available | 2021-09-09T04:57:47Z | - |
dc.date.issued | 2020-12 | - |
dc.identifier.citation | Acs Applied Polymer Materials, v. 3, no. 3, page. 1293-1305 | en_US |
dc.identifier.issn | 2637-6105 | - |
dc.identifier.uri | https://pubs.acs.org/doi/10.1021/acsapm.0c01061 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/165018 | - |
dc.description.abstract | A quasi-isotropic percolation network with enhanced thermal conductivity was prepared with a hexagonal boron nitride/poly(methyl methacrylate) (h-BN/PMMA) composite using a double filler-to-polymer structure (D-structure) approach. Using a three-dimensional (3-D) polygonal network of PMMA beads and the additional application of a PMMA resin with a different solubility, a secondary polymer-assisted filler percolation, the D-structure, was generated. The 3-D thermal percolation routes based on the D-structure generated in-plane (20 vol % of h-BN) and out-of-plane (30 vol % of h-BN) percolations of the polymer nanocomposites with quasi-isotropic thermal properties. Moreover, compared to a bare PMMA sheet, the composites showed 44 times enhancement of out-of-plane thermal conductivity (6.34 W m–1 K–1) and 51 times enhancement of in-plane thermal conductivity (7.34 W m–1 K–1) with 50 vol % h-BN filler loading. The dual 3-D thermal percolation routes, with in-plane and out-of-plane percolations, were generated in the polymer nanocomposites even after incorporation of a two-dimensional h-BN filler. A COMSOL thermal conducting simulation was designed to elucidate the creation of high thermal conductivity pathways through the composites. Thermal percolation thresholds over the generation of D-structure networks were revealed by correlating the infrared (IR) camera, COMSOL thermal conducting simulation, and infrared microscopy analyses. | en_US |
dc.description.sponsorship | This research was supported by Future Materials Discovery Program through the National Research Foundation of Korea (NRF) funded by Ministry of Science, ICT and Future Planning (NRF-2019M3D1A2104158) and the Technology Innovation Program (20004041) funded by the Ministry of Trade, Industry and Energy (MOTIE, Korea). | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | American Chemical Society | en_US |
dc.subject | polymer nanocomposite | en_US |
dc.subject | double-percolation system | en_US |
dc.subject | isotropic conduction | en_US |
dc.subject | thermal conductivity | en_US |
dc.subject | thermal percolation | en_US |
dc.subject | COMSOL simulation | en_US |
dc.title | Quasi-Isotropic Thermal Conduction in Percolation Networks: Using the Pore-Filling Effect to Enhance Thermal Conductivity in Polymer Nanocomposites | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1021/acsapm.0c01061 | - |
dc.relation.page | 1-13 | - |
dc.relation.journal | Acs Applied Polymer Materials | - |
dc.contributor.googleauthor | Ryu, Seung Han | - |
dc.contributor.googleauthor | Cho, Hong-Baek | - |
dc.contributor.googleauthor | Kwon, Young-Tae | - |
dc.contributor.googleauthor | Song, Yoseb | - |
dc.contributor.googleauthor | Lee, Jimin | - |
dc.contributor.googleauthor | Lee, Sang-Bok | - |
dc.contributor.googleauthor | Choa, Yong-Ho | - |
dc.relation.code | 2020058358 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING | - |
dc.identifier.pid | choa15 | - |
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