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dc.contributor.author홍승호-
dc.date.accessioned2021-09-09T04:46:57Z-
dc.date.available2021-09-09T04:46:57Z-
dc.date.issued2020-12-
dc.identifier.citationIEEE INDUSTRIAL ELECTRONICS MAGAZINE, v. 14, no. 4, Ppge. 146-157en_US
dc.identifier.issn1932-4529-
dc.identifier.issn1941-0115-
dc.identifier.urihttps://ieeexplore.ieee.org/document/9299411?arnumber=9299411&SID=EBSCO:edseee-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/164997-
dc.description.abstractThe fourth industrial revolution, also termed Industry 4.0 (I4.0), will digitalize manufacturing operations and decentralize them from the shop floor to the office and across entire enterprise networks [1]. The proposed system-level digitalization solutions for I4.0 include cyber-physical systems [2] and digital twins [3]. Standardized I4.0 technologies are urgently required to change industry and guide market usage. The asset administration shell (AAS) of the I4.0 component [4] is a German symbolic model that is under development as an international standard in International Electrotechnical Commission (IEC) project 63278-1. Not all engineers, researchers, and entrepreneurs have a basic knowledge of the AAS. Very few understand how to employ an AAS in practice. This article uses AASs to implement an I4.0 scenario, thus plug and produce (PnP) of industrial field devices. A three-layer, AAS-based implementation of PnP manufacture in line with I4.0 is developed. The synergy is to show that the AAS may help expedite I4.0 digitalization and propel its applications forward.en_US
dc.description.sponsorshipThis work was supported under the framework of the International Cooperation Program (Korea-China) managed by the National Research Foundation of Korea (grants NRF-2018K1A3A1A61026320 and NRF-2016K2A9A2A11938310).en_US
dc.language.isoen_USen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.titleToward the Plug-and-Produce Capability for Industry 4.0 An Asset Administration Shell Approachen_US
dc.typeArticleen_US
dc.relation.no4-
dc.relation.volume14-
dc.identifier.doi10.1109/MIE.2020.3010492-
dc.relation.page146-157-
dc.relation.journalIEEE INDUSTRIAL ELECTRONICS MAGAZINE-
dc.contributor.googleauthorYe, X.-
dc.contributor.googleauthorJiang, J.-
dc.contributor.googleauthorLee, C.-
dc.contributor.googleauthorKim, N.-
dc.contributor.googleauthorYu, M.-
dc.contributor.googleauthorHong, S.-
dc.relation.code2020053778-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDIVISION OF ELECTRICAL ENGINEERING-
dc.identifier.pidshhong-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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