FCVA 방법으로 증착된 DLC 박막의 계면 및 구조분석

Abstract

본 연구에서는 FCVA 방법으로 기판전압 0V에서 -250V까지 변화시키면서 DLC박막을 증착한 후, Raman 분석을 통한 탄소 결합구조의 변화를 관찰하였다. DLC films are deposited using a modified FCVA system. Carbon amorphous networks, chemical bonding states, sp fraction, interfaces, and structures are studied as a function of substrate voltage ( 0 250V) . The sp3 content in the films is evaluated by analyzing the XPS spectra(CIs). The structural properties of the surface, bulk, and interfacial layers in DLC/Si systems are quantitatively analyzed by employing XRR method. As the substrate voltage is increased, the sp3 fraction is decreased by means of XPS and Raman spectroscopy. In addition, the structural properties (interfacial layer, contamination layer, and sp3 fraction) derived from XPS depth profile are relatively correlated with the XRR results.