고속/정밀 위치제어시스템의 모델링 및 제어에 관한 연구

Abstract

This paper presents a dynamic modeling and a sliding mode controller for the high- speed/highaccuracy position control system. The selected target system is the wire bonder head assembly which is used in the semiconductor assembly process. This system is a reciprocating one around the pivot point that consists of VCM(voice coil motor) as an actuator and transducer horn as a bonding tool. For the modeling elements, the system is divided into electrical circuit, magnetic circuit and mechanical system. Each system is modeled using the bond graph method and united into the full system. Two major aims are considered in the design of the controller. The first one is that the horn must track the given reference trajectory. The second one is that the controller must be realizable by using the DSP board. Computer simulation and experimental results show that the designed sliding mode controller provides better performance than the PID controller.