Repository at Hanyang UniversityCOLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E](과학기술융합대학)PHOTONICS AND NANOELECTRONICS(나노광전자학과)Articles
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Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 심종인 | - |
| dc.date.accessioned | 2021-02-16T00:44:33Z | - |
| dc.date.available | 2021-02-16T00:44:33Z | - |
| dc.date.issued | 2001-06 | - |
| dc.identifier.citation | 대한전자공학회 종합 학술 대회 논문집 (하계) 2001, Vol.2 : 반도체 소사이어티, v. 24, no. 1, page. 133-136 | en_US |
| dc.identifier.uri | https://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE06329214 | - |
| dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/158258 | - |
| dc.description.abstract | A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package. | en_US |
| dc.language.iso | ko_KR | en_US |
| dc.publisher | 대한전자공학회 | en_US |
| dc.title | 공진현상 감소를 위한 집적회로 패키지 설계 및 모델링 | en_US |
| dc.title.alternative | Integrated Circuit(IC) Package Analysis, Modeling, and Design for Resonance Reduction | en_US |
| dc.type | Article | en_US |
| dc.relation.journal | 국내Proceeding(기타) | - |
| dc.contributor.googleauthor | 안덕근 | - |
| dc.contributor.googleauthor | 어영선 | - |
| dc.contributor.googleauthor | 심종인 | - |
| dc.relation.code | 2012101921 | - |
| dc.sector.campus | E | - |
| dc.sector.daehak | COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E] | - |
| dc.sector.department | DEPARTMENT OF PHOTONICS AND NANOELECTRONICS | - |
| dc.identifier.pid | jishim | - |
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