Repository at Hanyang UniversityCOLLEGE OF ENGINEERING SCIENCES[E](공학대학)MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)Articles
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Dissolution of Cu into Sn-Based Solders during Reflow Soldering
- Title
- Dissolution of Cu into Sn-Based Solders during Reflow Soldering
- Author
- 신동혁
- Keywords
- reflow soldering; supersaturation; channel; Cu6Sn5; Sn-37Pb
- Issue Date
- 2003-12
- Publisher
- KOREAN INST METALS MATERIALS
- Citation
- METALS AND MATERIALS INTERNATIONAL, v. 9, issue. 6, page. 577-581
- Abstract
- Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations.
- URI
- https://link.springer.com/article/10.1007/BF03027258https://repository.hanyang.ac.kr/handle/20.500.11754/156709
- ISSN
- 1598-9623
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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