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dc.contributor.author김희준-
dc.date.accessioned2020-12-16T04:43:21Z-
dc.date.available2020-12-16T04:43:21Z-
dc.date.issued2003-09-
dc.identifier.citation전기학회논문지, v. 52B, no. 9, page. 468-474en_US
dc.identifier.issn1229-2451-
dc.identifier.urihttp://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE01259976-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/156249-
dc.description.abstractThis paper describes the development of an open frame type high power density switching converter. It is based on the active clamp forward converter with synchronous rectifier, and packaged by using the open frame and multi-layer printed circuit board (PCB) technology to achieve the higher power density. Furthermore, the windings of transformer and inductor are also realized by multi-layer PCB so that it also contributes to achieve higher power density. Through the experiment on the proto-type converter of 50[W], it is confirmed that power density of 50[W/in3] and maximum efficiency of over 91[%] are obtained.en_US
dc.language.isoko_KRen_US
dc.publisher대한전기학회en_US
dc.subjectopen frame type high power density switching converteren_US
dc.subjectactive clamp forward converter, multi-layer PCBen_US
dc.title개방형 고밀도 스위칭 컨버터의 개발en_US
dc.title.alternativeDevelopment of An Open Frame Type High Power Density Switching Converteren_US
dc.typeArticleen_US
dc.relation.journal전기학회논문지(A,B,C,D)-
dc.contributor.googleauthor오용승-
dc.contributor.googleauthor김희준-
dc.relation.code2012101073-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDIVISION OF ELECTRICAL ENGINEERING-
dc.identifier.pidhjkim-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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