CFD를 이용한 CMP의 Groove Sizing 최적화

Abstract

In this paper, slurry fluid motion, abrasive particle motion, and effects of groove sizing on the pads are numerically investigated in the 2D geometry. Groove depth is optimized in order to maximized the abrasive effect. The simulation results are analyzed in terms of shear stress on pad, groove and wafer, streamline and velocity vector. The change of groove depth entails vortex pattern change, and consequently affects material removal rate. Numerical analysis is very helpful for disclosing polishing mechanism and local physics. 기호설명 M.R.R 웨이퍼(wafer)가 연마된 정도 (Å/min) (Material Removal Rate)