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dc.contributor.author박진성-
dc.date.accessioned2020-07-23T02:42:52Z-
dc.date.available2020-07-23T02:42:52Z-
dc.date.issued2019-07-
dc.identifier.citationIEEE ELECTRON DEVICE LETTERS, v. 40, no. 7, Page. 1128-1131en_US
dc.identifier.issn0741-3106-
dc.identifier.issn1558-0563-
dc.identifier.urihttps://ieeexplore.ieee.org/document/8730370-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/151849-
dc.description.abstractPrior research has reported that the device characteristics of amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistors (TFTs) have been changed by instabilities due to electrical stress. Because positive bias stress and high current stress produce a positive threshold voltage shift, if the digital logic circuit is designed using a-IGZO TFTs, there is a high possibility that the circuit suffers from malfunction. In this letter, the dynamic and the static logic circuits using n-type a-IGZO TFTs are compared in terms of stability for electrical stress. In order to compare the stability of the two circuits, DC and AC signals are applied. The measurement results suggest that the dynamic logic circuit is much more stable than the static logic circuit regarding electrical stress.en_US
dc.description.sponsorshipThis work was supported in part by the Ministry of Trade, Industry and Energy (MOTIE) under Project 10052020 and in part by the Korea Display Research Corporation (KDRC) Support Program for the development of future devices technology for display industry.en_US
dc.language.isoenen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.subjectAmorphous indium-gallium-zinc-oxide thin-film transistors (a-IGZO TFTs)en_US
dc.subjectelectrical stressen_US
dc.subjectdynamic logicen_US
dc.subjectlogic circuitsen_US
dc.subjectTFTsen_US
dc.titleElectrical Stability Analysis of Dynamic Logic Using Amorphous Indium-Gallium-Zinc-Oxide TFTsen_US
dc.typeArticleen_US
dc.relation.no7-
dc.relation.volume40-
dc.identifier.doi10.1109/LED.2019.2920634-
dc.relation.page1128-1131-
dc.relation.journalIEEE ELECTRON DEVICE LETTERS-
dc.contributor.googleauthorKim, Yong-Duck-
dc.contributor.googleauthorKim, Jong-Seok-
dc.contributor.googleauthorLee, Jong-Il-
dc.contributor.googleauthorHan, Ki-Lim-
dc.contributor.googleauthorKim, Beom-Su-
dc.contributor.googleauthorPark, Jin-Seong-
dc.contributor.googleauthorChoi, Byong-Deok-
dc.relation.code2019003487-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MATERIALS SCIENCE AND ENGINEERING-
dc.identifier.pidjsparklime-
dc.identifier.orcidhttps://orcid.org/0000-0002-9070-5666-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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