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Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints

Title
Effect of Bond Thickness on the Fracture Toughness of Adhesive Joints
Author
최낙삼
Keywords
fracture toughness; joining processes; adhesives; adhesion; rubber; polymer blends; curing; crack-edge stress field analysis; polymer structure
Issue Date
2004-01
Publisher
ASME-AMER SOC MECHANICAL ENG
Citation
Journal of Engineering Materials and Technology, v. 126, No. 1, Page. 14-18
Abstract
The effect of bond thickness on the fracture toughness of adhesive joints was investigated from a microstructural perspective, using compact tension (CT) adhesive-joint specimens with different bond thicknesses. The adhesive material was a rubber-modified epoxy resin with 12.5 wt% carboxy-terminated butadiene acrylonitrile (CTBN) elastomer. The shapes of the rubber particles dispersed in adhesive layers of damaged and undamaged specimens were observed with an optical microscope. The damage was distributed along the interfaces between the adhesive layer and the two adherends. The results show that the primary causes of variations in the fracture toughness of an adhesive joint with the bond thickness are not only a damage zone around a crack tip but also the combination of a damage zone around a crack tip and additional damage zones along the interfaces.
URI
https://asmedigitalcollection.asme.org/materialstechnology/article/126/1/14/460934/Effect-of-Bond-Thickness-on-the-Fracture-Toughnesshttps://repository.hanyang.ac.kr/handle/20.500.11754/132001
ISSN
0094-4289
DOI
10.1115/1.1631433
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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