New Wafer-Level High-Frequency Characterization of Coupled Transmission Lines
- Title
- New Wafer-Level High-Frequency Characterization of Coupled Transmission Lines
- Author
- 어영선
- Keywords
- Characteristic impedance; deembedding; propagation constant; S-parameters; transmission lines
- Issue Date
- 2019-12
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Citation
- IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v. 67, No. 12, Page. 4674-4681
- Abstract
- In this article, a new experimental characterization technique for coupled transmission lines is presented. Three specific experimental test patterns (E-, F-, and G-type structures) that can individually characterize the electromagnetic coupling of two coupled lines are developed and fabricated on the same wafer using a 0.18-$\mu \text{m}$CMOS process. Since the devised test patterns are two-port networks, well-established two-port network characterization techniques can be exploited. Transmission line model parameters (i.e., propagation constants and characteristic impedances) associated with the three two-port test patterns can be directly determined from the measured S-parameters, followed by circuit model parameters ($R$ ,$L$ ,$C$ , and$G$ ) for two coupled lines. Without rigorous equipment calibration and deembedding parasitic effects, experimental characterizations for two coupled lines using four-port network S-parameter measurements may yield physically ambiguous data above 10 GHz due to the parasitic resonances, whereas the proposed technique can determine stable and accurate network parameters over a broad frequency band. To further support the validity of the proposed technique, they are compared with data using 3-D numerical calculations and low-frequency capacitance measurements.
- URI
- https://ieeexplore.ieee.org/document/8879682https://repository.hanyang.ac.kr/handle/20.500.11754/122255
- ISSN
- 0018-9480; 1557-9670
- DOI
- 10.1109/TMTT.2019.2944601
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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