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dc.contributor.author좌용호-
dc.date.accessioned2019-12-12T01:18:00Z-
dc.date.available2019-12-12T01:18:00Z-
dc.date.issued2019-09-
dc.identifier.citationACS Applied Electronic Materials, v. 1, No. 10, Page. 2069-2075en_US
dc.identifier.issn2637-6113-
dc.identifier.urihttps://pubs.acs.org/doi/abs/10.1021/acsaelm.9b00444-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/121254-
dc.description.abstractRecent advancements in smart electronics have brought an unprecedented number of electronic devices into our daily life, which leaves the burden of a growing e-waste. In particular, the emerging industry in printing science and technology has widely used Cu nanoparticles (NPs). To significantly reduce the e-waste on such metal NPs, it needs a solution in green manufacturing. Here, we introduce a simple green processing and material synthesis method. A nontoxic l-ascorbic acid, known as vitamin C in an aqueous solution, provides the driving force of both reducing and capping agents for a sustainable manufacturing of Cu-based NPs. Cu complex ions mixed with a reducing agent, l-ascorbic acid, prevents aggregation of NPs. An intermediate product, Cu2O NPs that can only absorb photonic energy are used to fabricate an electronic system due to a superior electrical resistivity (4.2 × 10–6 Ω·cm). The comprehensive study using spectroscopy, high-resolution electron microscopy, and X-ray diffraction fully characterizes the synthesized NPs. A demonstration of an electronic circuit that is prepared by a screen-printing and photonic sintering shows the potential for an eco-friendly manufacturing of various types of printed electronics.en_US
dc.language.isoen_USen_US
dc.publisherACSen_US
dc.subjectgreen manufacturingen_US
dc.subjectself-reductionen_US
dc.subjectCu2O nanoparticlesen_US
dc.subjectl-ascorbic aciden_US
dc.subjectphotonic-sintered printed electronicsen_US
dc.titleGreen Manufacturing of Highly Conductive Cu2O and Cu Nanoparticles for Photonic-Sintered Printed Electronicsen_US
dc.typeArticleen_US
dc.relation.no10-
dc.relation.volume1-
dc.identifier.doi10.1021/acsaelm.9b00444-
dc.relation.page2069-2075-
dc.relation.journalACS Applied Electronic Materials-
dc.contributor.googleauthorKwon, Young-Tae-
dc.contributor.googleauthorYune, Seung-Jae-
dc.contributor.googleauthorSong, Yoseb-
dc.contributor.googleauthorYeo, Woon-Hong-
dc.contributor.googleauthorChoa, Yong-Ho-
dc.relation.code2014042627-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING-
dc.identifier.pidchoa15-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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