Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김태원 | - |
dc.date.accessioned | 2019-12-10T04:39:22Z | - |
dc.date.available | 2019-12-10T04:39:22Z | - |
dc.date.issued | 2018-11 | - |
dc.identifier.citation | APPLIED MATHEMATICAL MODELLING, v. 63, page. 1-17 | en_US |
dc.identifier.issn | 0307-904X | - |
dc.identifier.issn | 1872-8480 | - |
dc.identifier.uri | https://www.sciencedirect.com/science/article/abs/pii/S0307904X18302610?via%3Dihub | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/120704 | - |
dc.description.abstract | This article conducts an exact analysis of a thermal dielectric crack moving in piezoelectric materials. Self-generating thermal and electric loadings by the crack interior are exerted on the crack surfaces as well as various external loadings including a shearing force. Fundamental solutions of the thermal and electro-elastic coupling fields are given by determining a temperature function and a harmonic function with eigenvalues properties due to material properties considered. Analytical expressions are obtained benefiting evaluation of key parameters. Numerical analysis is done and some interesting observations are found. There is a critical crack velocity within and beyond which the electric loading exerts different influences on the thermal flux of crack interior and the thermal stress intensity factor. (C) 2018 Elsevier Inc. All rights reserved. | en_US |
dc.description.sponsorship | The authors are grateful for Professor Fengjun Li for his helpful discussion in the revision process. This work was supported by the National Natural Science Foundation of China (11472193, 11572227 and 11261042 as 61662060), the Major Innovation Projects for Building First-class Universities in China's Western Region (ZKZD2017009), and the Fundamental Research Funds for the Central Universities (1330219162). | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | ELSEVIER SCIENCE INC | en_US |
dc.subject | Thermal dielectric | en_US |
dc.subject | Moving crack | en_US |
dc.subject | Shearing force | en_US |
dc.subject | Analytical expressions | en_US |
dc.subject | Critical crack velocity | en_US |
dc.title | A moving thermal dielectric crack in piezoelectric ceramics with a shearing force applied on its surface | en_US |
dc.type | Article | en_US |
dc.relation.volume | 63 | - |
dc.identifier.doi | 10.1016/j.apm.2018.06.016 | - |
dc.relation.page | 1-17 | - |
dc.relation.journal | APPLIED MATHEMATICAL MODELLING | - |
dc.contributor.googleauthor | Zhou, Y-T | - |
dc.contributor.googleauthor | Kim, T-W | - |
dc.relation.code | 2018008733 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | twkim | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.