Effects of interfacial layer-by-layer nanolayers on the stability of the Cu TSV:Diffusion barrier, adhesion, conformal coating, and mechanical property
- Title
- Effects of interfacial layer-by-layer nanolayers on the stability of the Cu TSV:Diffusion barrier, adhesion, conformal coating, and mechanical property
- Author
- 장재일
- Keywords
- Through-Silicon Via (TSV); Layer-by-layer (LbL); Poly(allylamine) hydrochloride (PAH)/; polystyrene sulfonate (PSS); Nano indentation; Stress reduction; Conformal coating
- Issue Date
- 2018-08
- Publisher
- ELSEVIER SCI LTD
- Citation
- MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, v. 83, page. 33-41
- Abstract
- The Through-Silicon (Si) Via (TSV) is the integration technology for three-dimensional integrated-circuit packaging. The layer-by-layer (LbL) technique has been used to deposit flexible poly(allylamine) hydrochloride (PAH)/polystyrene sulfonate (PSS) multilayers inside scalloped Si trenches of a high aspect ratio, fabricated by the Bosch-etching process. An outstanding control of the thickness and the conformality of the polymer layers, along with a significantly improved planarization, was achieved due to the LbL-technique self-termination effects. In addition, the basic properties of the polymer layers have been characterized: diffusion-barrier properties, adhesion, density, and elastic modulus. The results of this study demonstrate the feasibility of LbL multilayers regarding the TSV liner for the vertical interconnect accesses with a high aspect ratio of highly scalloped surface walls.
- URI
- https://www.sciencedirect.com/science/article/pii/S1369800117327129?via%3Dihubhttps://repository.hanyang.ac.kr/handle/20.500.11754/119707
- ISSN
- 1369-8001; 1873-4081
- DOI
- 10.1016/j.mssp.2018.04.008
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
- Files in This Item:
There are no files associated with this item.
- Export
- RIS (EndNote)
- XLS (Excel)
- XML