Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 정재경 | - |
dc.date.accessioned | 2019-11-30T19:16:28Z | - |
dc.date.available | 2019-11-30T19:16:28Z | - |
dc.date.issued | 2017-09 | - |
dc.identifier.citation | THIN SOLID FILMS, v. 637, page. 3-8 | en_US |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | https://www.sciencedirect.com/science/article/pii/S004060901730189X?via%3Dihub | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/115714 | - |
dc.description.abstract | A low resistivity copper (Cu) film was used as a source/drain contact layer to fabricate high performance amorphous In-Zn-Sn-O (a-IZTO) thin-film transistors (TFTs). The calcium (Ca)-doped Cu films greatly simplified the conventional Cu/diffusion barrier stack structure and process, which allowed the production of promising aIZTO TFTs with a saturation mobility of 22.8 cm(2)/Vs and an ION/OFF ratio of 108. Furthermore, the a-IZTO TFTs with the Ca -doped Cu contact exhibited better gate bias thermal stress-induced stabilities than those with the pure Cu contact. This was attributed to the effective formation of a self-diffusion CuO. barrier at the Cu/IZTO interfaces. (C) 2017 Elsevier B.V. All rights reserved. | en_US |
dc.description.sponsorship | This study was supported by the National Research Foundation of Korea (NRF) grant funded by the Korean government (NRF-2015R1A2A2A01003848). | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | ELSEVIER SCIENCE SA | en_US |
dc.subject | Amorphous indium tin zinc oxide | en_US |
dc.subject | Copper-calcium alloy | en_US |
dc.subject | High mobility | en_US |
dc.subject | Thin-film transistors | en_US |
dc.subject | Stability | en_US |
dc.title | High performance a-InZnSnO thin-film transistor with a self-diffusion-barrier formable copper contact | en_US |
dc.type | Article | en_US |
dc.relation.no | 1 | - |
dc.relation.volume | 637 | - |
dc.identifier.doi | 10.1016/j.tsf.2017.03.014 | - |
dc.relation.page | 3-8 | - |
dc.relation.journal | THIN SOLID FILMS | - |
dc.contributor.googleauthor | Lee, Sang Ho | - |
dc.contributor.googleauthor | Oh, Dong Ju | - |
dc.contributor.googleauthor | Hwang, Ah Young | - |
dc.contributor.googleauthor | Park, Jong Wan | - |
dc.contributor.googleauthor | Jeong, Jae Kyeong | - |
dc.relation.code | 2017002883 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DEPARTMENT OF ELECTRONIC ENGINEERING | - |
dc.identifier.pid | jkjeong1 | - |
dc.identifier.orcid | http://orcid.org/0000-0003-3857-1039 | - |
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