Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 이도형 | - |
dc.date.accessioned | 2019-09-09T04:40:18Z | - |
dc.date.available | 2019-09-09T04:40:18Z | - |
dc.date.issued | 2005-04 | - |
dc.identifier.citation | 대한기계학회논문집 B, v. 29, No. 4, Page. 435 - 440 | en_US |
dc.identifier.issn | 1226-4881 | - |
dc.identifier.uri | http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE00586748&language=ko_KR | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/110390 | - |
dc.description.abstract | In this paper, slurry fluid motion, abrasive particle motion, and roles of groove patterns on the pads are numerically investigated in the 2D and 3D geometries. The simulation results are analyzed in terms of experimental removal rate and WIWNU (Within Wafer Non-Uniformity) for ILD (Inter Level Dielectric) CMP process. Numerical investigations reveal that the grooves in the pad behave as uniform distributor of abrasive particles and enhance the removal rate by increasing shear stress. Higher removal rate and desirable uniformity are numerically and experimentally observed at the pad with grooves. Numerical analysis is very well matched with experimental results and helpful for understanding polishing mechanism and local physics. | en_US |
dc.language.iso | ko_KR | en_US |
dc.publisher | 대한기계학회 | en_US |
dc.title | Oxide CMP 과정에 대한 수치 유동 해석 | en_US |
dc.title.alternative | Numerical Study on Polishing Behavior During Oxide CMP | en_US |
dc.type | Article | en_US |
dc.relation.journal | 대한기계학회논문집 B | - |
dc.contributor.googleauthor | 권달중 | - |
dc.contributor.googleauthor | 이도형 | - |
dc.contributor.googleauthor | 김인환 | - |
dc.relation.code | 2012100289 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | dohyung | - |
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