Aerial image; EUV lithography; Mask absorber; Mask thickness; Near field
Proceedings of SPIE, Emerging Lithographic Technologies IX, v. 5751, Page. 670-677
Selectivity of extreme ultra-violet lithography mask's material and thickness significantly influences on pattern formation. Since the reflectance changes periodically depending on absorber thickness, we investigated the absorber thickness effect on to near field and aerial image for 32 nm line/space and isolated pattern. We chose germanium and chromium as absorber materials. We also investigated the line width variation by absorber thickness change with different duty ratios. SOLID-EUV of sigma-C was used for this study.