Layout Design Optimization for Manufacturability by Using 2D Compaction
- Title
- Layout Design Optimization for Manufacturability by Using 2D Compaction
- Author
- 신현철
- Issue Date
- 2006-10
- Publisher
- 대한전자공학회
- Citation
- ISOCC 2006 Conference, Page. 209 - 212
- Abstract
- Layout modification techniques have been developed for yield and realiability enhancement. As CMOS manufacturing technology is scaled down to 90 nm and below, designers need to consider complicated physical effects, and thus the number of design rules to maintain is rapidly increasing. Important features of layout optimization include forbidden pitch, end-of-wire extension, and redundant via insertion. To complete the targeted layout optimization within minimal area, we use two-dimensional layout compaction techniques. When the layout is given in geometric from, we extract its symbolic layout by identifying transistors, vias, and wires, and then use compaction to optimize the layout. Experimental results show that the suggested techniques are promising in optimizing layout for manufacturability.
- URI
- http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE01793043&language=ko_KRhttps://repository.hanyang.ac.kr/handle/20.500.11754/108616
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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