Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface
- Title
- Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface
- Author
- 김학성
- Keywords
- Semiconductor package; Adhesion strength; Plasma treatment; moisture absorption
- Issue Date
- 2019-01
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Citation
- MICROELECTRONICS RELIABILITY, v. 92, Page. 63-72
- Abstract
- Reliability of interface between two dissimilar materials becomes an important issue due to increasing demands
of high-density integrated circuits. Most of failures of semiconductor package occur at the interface between two
dissimilar materials in high temperature reflow process, thus, adhesion strength under high temperature should
be investigated. In this study, an adhesion shear test jig was newly devised to measure the adhesion strength of
epoxy molding compound/Si chip (EMC/chip) interface at high temperature (200 °C). In order to investigate the
effect of plasma treatment on adhesion strength and moisture absorption characteristics, the number of plasma
treatments was varied. Also, moisture absorption time was varied to observe the moisture uptake and degradation
of adhesion strength with respect to plasma treatment number. Atomic force microscope (AFM) was
analyzed to verify the surface roughness of silicon chip, and scanning electron microscopy (SEM) was used to
observe cross-sectional fractured morphology after adhesion strength test. From this study, it was found that the
plasma treatments affect much the adhesion strength and moisture uptake at the interface between the EMC/
Chip interface.
- URI
- https://www.sciencedirect.com/science/article/pii/S002627141831076X?via%3Dihubhttps://repository.hanyang.ac.kr/handle/20.500.11754/108055
- ISSN
- 0026-2714
- DOI
- 10.1016/j.microrel.2018.11.004
- Appears in Collections:
- COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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