A study on the relationship between print-ability and flash light sinter-ability of Cu nano/micro-ink for printed electronics

Abstract

In this study, the effect of rheological properties of Cu nano/micro (NP/MP)-inks with various amounts of dispersant on the print-ability and sinter-ability for flash light sintering was investigated. The rheological properties such as viscosity, viscoelasticity and thixotropic index of Cu NP/MP-inks were measured using a rheometer. The fabricated Cu NP/MP-inks were printed on polyimide substrate using a screen printing method. The 3D profile of printed Cu NP/MP-ink pattern was measured using surface profiler. In order to sinter the printed Cu NP/MP-inks, flash light sintering technique was employed. The flash light irradiation conditions (pulse power, pulse number, on-time, and off-time) were optimized to obtain the high sintering characteristic of Cu NP/MP-inks. In order to characterize the microstructures and transformation crystal phase of the sintered Cu NP/MP-inks, scanning electron microscopy, focused ion-beam and X-ray diffraction analysis were performed. From the results, the optimal sintered Cu NP/MP-ink film had a 6.16 μΩ·cm resistivity and 5B level of adhesion strength.