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dc.contributor.author어영선-
dc.date.accessioned2019-07-03T07:22:01Z-
dc.date.available2019-07-03T07:22:01Z-
dc.date.issued2007-10-
dc.identifier.citationISOCC 2007 Conference, Page. 163 - 166en_US
dc.identifier.urihttp://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE01789571&language=ko_KR-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/107088-
dc.description.abstractA novel modal decoupling technique for multicoupled transmission lines embedded within arbitrary dielectric materials is developed. Unlike the conventional algorithms, the multi-coupled signals are decoupled by using the characteristic impedance of the system. Thereby, the signal transients of multi-coupled transmission lines can be very accurately as well as efficiently simulated by combining the proposed method. It is shown that the wave shapes obtained by using the technique are in excellent agreement with those obtained with SPICE simulation.en_US
dc.language.isoko_KRen_US
dc.publisher대한전자공학회en_US
dc.subjectmodal decoupling techniqueen_US
dc.subjectmulti-coupled transmission linesen_US
dc.subjectcrosstalken_US
dc.subjectsignal transienten_US
dc.titleA novel unified modal decoupling technique for efficient multi-conductor signal integrity verificationen_US
dc.typeArticleen_US
dc.contributor.googleauthorKim, Hyunsik-
dc.contributor.googleauthorKim, Youngjoo-
dc.contributor.googleauthorEo, Yungseon-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDIVISION OF ELECTRICAL ENGINEERING-
dc.identifier.pideo-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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