Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 어영선 | - |
dc.date.accessioned | 2019-05-13T01:18:20Z | - |
dc.date.available | 2019-05-13T01:18:20Z | - |
dc.date.issued | 2009-04 | - |
dc.identifier.citation | Conference Proceedings | en_US |
dc.identifier.uri | https://www.semanticscholar.org/paper/High-Frequency-Characterization-and-Circuit-of-Via-Kim-Eo/13f8a0be9c34b320001b004d52a0419a3d75f28a?tab=abstract | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/103909 | - |
dc.description.abstract | A via is experimentally characterized by using highfrequency s-parameter measurements. Test patterns are designed and fabricated by using a package process. They are measured by using VNA (vector network analyzer) up to 25GHz. The parasitic effects due to access lines for on-wafer probing are deembedded. Then modeling the via as two equivalent circuits (Ttype and Pi-type), the circuit model parameters are determined. It is shown that the T-type circuit model has excellent agreement with the measured s-parameters. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | GSMM | en_US |
dc.subject | s-parameter | en_US |
dc.subject | de-embedding | en_US |
dc.subject | circuit model | en_US |
dc.title | High-Frequency Characterization and Circuit Modeling of Via in Multi-Layered IC Package | en_US |
dc.type | Article | en_US |
dc.contributor.googleauthor | Kim, Hyewon | - |
dc.contributor.googleauthor | Eo, Yungseon | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DIVISION OF ELECTRICAL ENGINEERING | - |
dc.identifier.pid | eo | - |
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