크랙 용액을 이용한 무정형 메쉬 전극 제작

Abstract

This study presents the method of fabrication for copper (Cu) random meshes, which have been made via solution process using a crack gel, for transparent conducting electrodes (TCEs). The crack gel was deposited on PET substrates via spin-coating. It was observed that the line width of the random mesh depended on the thickness of the crack gel. The random mesh electrodes were fabricated by depositing Cu films on the random cracks via electroless plating. For all of the electrode specimens, their surface morphologies were measured using a field-emission scanning electron microscope (FESEM). Also, the thickness profiles of the electrodes were measured using a stylus profilometer.