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다이아몬드 분말상에 무전해 Ni-B 도금을 위한 계면활성제의 영향

Title
다이아몬드 분말상에 무전해 Ni-B 도금을 위한 계면활성제의 영향
Other Titles
Effect of Surfactant in Electroless Ni-B Plating for Coating on the Diamond Powder
Author
유봉영
Keywords
Diamond wire saw; Diamond powder; Electroless deposition; Reducing agent; Complexing agent; Dispersant; Surfactant
Issue Date
2017-06
Publisher
한국표면공학회
Citation
한국표면공학회지, v. 50, No. 3, Page. 177-182
Abstract
The properties of electroless Ni-B thin film on diamond powder with different parameters (temperature, pH, surfactant etc.) were studied. The surface morphology, structure and composition distribution of the Ni- B film were observed by field effect scanning electron microscope (FE-SEM), energy-dispersive spectrometer (EDS), X-ray diffraction (XRD) and Auger electron spectroscopy (AES). The growth rate of Ni-B film was increased with increase of bath temperature. The B content in Ni-B film was reduced with increase of bath pH. As a result the structure of Ni-B film was changed from amorphous to crystalline structure. The PVP in solution plays multi-functional roles as a dispersant and a stabilizer. The Ni-B film deposited with adding 0.1 mM-PVP was strongly introduced an amorphous structure with higher B content (25 at.%). Also the crystallite size of Ni-B film was reduced from 12.7 nm to 5.4 nm.
URI
http://www.dbpia.co.kr/Journal/ArticleDetail/NODE07196085https://repository.hanyang.ac.kr/handle/20.500.11754/103416
ISSN
1225-8024
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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