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Showing results 141 to 160 of 352

Issue DateTitleAuthor(s)
2016-12Evaluation of competitive reaction of various cu CMP slurry components박진구
2013-04Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates박진구
2013-04Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates박진구
2011-12Evaluation of glass lapping using fixed abrasive pad박진구
2016-02Evaluation of various composition Cu-resin plates in sapphire DMP (Diamond Mechanical Polishing) process박진구
2013-01Evaluation of very dilute alkaline solutions for wafer cleaning with megasonic irradiation박진구
2005-12Experimental and analytical study of submicrometer particle removal from deep trenches박진구
2006-07Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time박진구
2010-07Fabrication and Characterization of a 32 x 32 Array Digital Si-PIN X-ray Detector for a Single Photon Counting Image Sensor박진구
2013-08Fabrication of 3D micro structure by dual diffuser lithography박진구
2012-03Fabrication of a hydrophobic/hydrophilic hybrid-patterned microarray chip and its application to a cancer marker immunoassay박진구
2012-03Fabrication of a hydrophobic/hydrophilic hybrid-patterned microarray chip and its application to a cancer marker immunoassay박진구
2005-11Fabrication of a Patterned Replica by Hot Embossing on Various Thicknesses of PMMA박진구
2014-12Fabrication of bumping mask for flip-chip process on stainless steel using through mask electrochemical micro machining(TMEMM)박진구
2018-04Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire박진구
2018-04Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire박진구
2005-09Fabrication of Hot Embossing Plastic Stamps for Microstructure박진구
2016-06Fabrication of hydrophobic/hydrophilic switchable aluminum surface using poly(N-isopropylacrylamide)박진구
2016-10Fabrication of hydrophobic/hydrophilic switchable aluminum surface using poly(N-isopropylacrylamide)박진구
2012-01Fabrication of Large-Area CoNi Mold for Nanoimprint Lithography박진구

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