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dc.contributor.author박성주-
dc.date.accessioned2018-06-27T02:10:52Z-
dc.date.available2018-06-27T02:10:52Z-
dc.date.issued2017-07-
dc.identifier.citationIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v. 64, No. 7, Page. 822-826en_US
dc.identifier.issn1549-7747-
dc.identifier.issn1558-3791-
dc.identifier.urihttps://ieeexplore.ieee.org/document/7548308/-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/72238-
dc.description.abstractSemiconductor aging is a serious threat to the reliability of a system. We address the aging level of semiconductor components by describing the degree of semiconductor aging under certain operating conditions, including voltage, frequency, temperature, and usage rate. Aging level information can be used to follow the real aging rate of a device, predict the remaining life, and control the device performance under certain degradation conditions by balancing the operation of various device components. Such applications can improve the reliability of automotive semiconductor systems, which should have longer lives than mobile systems. In this brief, we present an aging level estimating flip-flop (FF) that can be used for these and other applications as well. Moreover, we can control the operation of the proposed FF by controlling its clock and control signals. We demonstrate an application of the proposed FF for aging-monitoring, showing that, by halting the operation of the proposed FF, the power consumption is significantly reduced compared with other approaches.en_US
dc.description.sponsorshipThis work was supported in part by the IT R&D program of the Ministry of Trade, Industry and Energy/Korea Evaluation Institute of Industrial Technology under Grant 10045313 and in part by the National Research Foundation of Korea Grant funded by the Ministry of Education, Science and Technology under Grant NRF-2013R1A1A2059326. A portion of this work was published in the IEEE European Test Symposium in 2015. This brief was recommended by Associate Editor D. D.-C. Lu. (Corresponding author: Sungju Park.)en_US
dc.language.isoen_USen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.subjectAging levelen_US
dc.subjectaging-monitoringen_US
dc.subjectguard banden_US
dc.subjectonline testen_US
dc.subjectscan flip-flop (FF)en_US
dc.subjectFAILURE PREDICTIONen_US
dc.titleOn Diagnosing the Aging Level of Automotive Semiconductor Devicesen_US
dc.typeArticleen_US
dc.relation.no7-
dc.relation.volume64-
dc.identifier.doi10.1109/TCSII.2016.2601959-
dc.relation.page822-826-
dc.relation.journalIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS-
dc.contributor.googleauthorJung, Jihun-
dc.contributor.googleauthorAnsari, Muhammad Adil-
dc.contributor.googleauthorKim, Dooyoung-
dc.contributor.googleauthorYi, Hyunbean-
dc.contributor.googleauthorPark, Sungju-
dc.relation.code2017000349-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF COMPUTING[E]-
dc.sector.departmentDIVISION OF COMPUTER SCIENCE-
dc.identifier.pidpaksj-
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COLLEGE OF COMPUTING[E](소프트웨어융합대학) > COMPUTER SCIENCE(소프트웨어학부) > Articles
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