| 2020-08 | SeTeZn Chalcogenide Materials-based Threshold Switching Characteristics | 박미현 |
| 2024 | Spin-Orbit Torque-Driven Artificial Devices and Reconfigurable Logic gates by Anomalous Hall Effect in W/CoFeB/MgO Frame | 신정훈 |
| 2016-02 | STABILIZATION OF NICKEL CONDUCTIVE FILAMENT FOR IMPROVING RESISTIVE SWITCHING | 박진규 |
| 2023 | Stabilization of tetragonal phase in zirconium dioxide thin films using atomic layer deposition | 송석휘 |
| 2016-08 | STI CMP 공정에서 산화규소와 다결정규소 막질의 선택적 연마 메커니즘에 관한 연구 | 조윤성 |
| 2022 | Studies on electrical diagnostic methods for measurement of plasma parameters and dielectric film thickness in deposition plasmas | 이무영 |
| 2017-02 | Studies on high temporal resolution probe diagnostic methods for rapidly changing plasmas | 김동환 |
| 2019-02 | Studies on the nanoscale topography enhancement of tungsten film by using solid silica core – mesoporous silica shell nanoparticles in tungsten CMP | Cho, Sung wook |
| 2017-02 | STUDY OF LOW-K SIOC FILMS DEPOSITED VIA ATOMIC LAYER DEPOSITION | 이재민 |
| 2016-02 | Study of Low-temperature SiO2 Deposition and Carbon-doping using Remote Plasma Atomic Layer Deposition | 김홍기 |
| 2020-08 | Study on Chemical Mechanical Planarization Performance Characteristics of Cobalt CMP Slurry according to Corrosion and Passivation Behavior | 최한얼 |
| 2024 | Study on In-situ O2 Plasma Treatment at RPCVD of SiOC Thin Film using Styrene-Contained Precursor | 김응주 |
| 2021 | Study on optical and thermo-mechanical stability of Ru/Si-rich SiNx EUV pellicle composite | 장용주 |
| 2018-08 | Study on the adsorption of PEG for high removal selectivity in tungsten CMP | Sounghyun So |
| 2017-08 | Study on the reduction of blooming effects in CMOS image sensor | KOH, Hyun Seung |
| 2019-02 | The effects of doping concentration and position on characteristics of Al doped SnO2 thin film transistors | Park, Joohyun |
| 2021 | Thermal atomic layer deposition of Molybdenum trioxide (MoO3) using metal organic precursor and H2O reactant | 이정훈 |
| 2010-02 | Through Silicon Via 3D SiP에서 Sn-Ag capping 층을 이용한 칩과 칩 접합 | 이진수 |
| 2013-02 | TSV 메모리 인터페이스를 위한 디지털 위상 고정 루프 설계 | 장수영 |
| 2015-02 | TSV 최소 배치에 기반한 3차원 집적회로의 전력 공급 네트워크 합성 | 장철존 |
