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Non-Flexural Parallel Piston Movement across CMUT with Substrate-Embedded Springs

Title
Non-Flexural Parallel Piston Movement across CMUT with Substrate-Embedded Springs
Author
박관규
Keywords
Average volume displacement; Ultrasound; PCMUT; substrate-embedded springs; Non-flexural parallel piston movement
Issue Date
2014-09
Publisher
IEEE
Citation
Ultrasonics Symposium (IUS): 2014 IEEE International, 2014 Sept[2014년], pp. 591-594
Abstract
In this paper, we introduce a modified fabrication method for CMUTs with substrate-embedded springs (post-CMUTs or PCMUTs) to increase the fabrication yield. This modified fabrication process includes three additional steps from the previous process: vacuum cleaning prior to the wafer bonding step, thermal oxidation of the silicon piston top plate, and preservation of the 150-nm buried oxide (BOX) layer on top of the 250 nm Si layer of the bonded SOI wafer. These modifications increased the fabrication yield from 10% to 60%. For these newly fabricated PCMUT devices, we measured the electrical input impedance with a precision impedance analyzer, the plate displacement with a laser Doppler vibrometer (LDV), and the output pressure with a calibrated hydrophone. The measured electrical input impedance matches well with the FEA simulation results; the LDV measurement in air confirmed a non-flexural plate displacement; and the hydrophone measurement showed a peak-to-peak acoustic pressure of 27.6 kPa at a distance of 3.6 mm in immersion, corresponding to 1.05 MPa at the face of the transducer, for a particular test 2-D array element.
URI
http://ieeexplore.ieee.org/document/6932283/keywordshttp://hdl.handle.net/20.500.11754/52391
ISBN
978-1-4799-7049-0; 978-1-4799-7048-3
ISSN
1051-0117
DOI
1O.1109/ULTSYM.2014.0145
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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