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COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
ELECTRICAL ENGINEERING(전자공학부)
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Results 1-2 of 2 (Search time: 0.002 seconds).
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Issue Date
Title
Author(s)
2007-10
High-frequency-measurement-based IC package performance evaluation
어영선
2008-11
High-Frequency-Measurement-Based Circuit Modeling and Power/Ground Integrity Evaluation of Integrated Circuit Packages
어영선
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-Subject
1
Ball grid array (BGA) package
1
BGA Package
1
Frequency variant circuit model
1
frequency variant circuit model
1
Power distribution net
1
power distribution net
1
Skin effect
1
skin effect
-Date issued
1
2008
1
2007
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