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COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
ELECTRICAL ENGINEERING(전자공학부)
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Results 1-10 of 16 (Search time: 0.002 seconds).
Item hits:
Issue Date
Title
Author(s)
2021-04
DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package
백상현
2021-04
DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball
백상현
2021-10
Exploitations of Multiple Rows Hammering and Retention Time Interactions in DRAM Using X-Ray Radiation
백상현
2021-09
Fault Coverage Re-Evaluation of Memory Test Algorithms With Physical Memory Characteristics
백상현
2020-05
Energy straggling and an experimental investigation of Bragg's rule for Am-241 alpha particles in air and its constituents
백상현
2023-01
DDR4 Ball Grid Array Package Intermittent Fracture Effect on Signal Integrity
백상현
2023-01
Temperature Estimation of HBM2 Channels with Tail Distribution of Retention Errors in FPGA-HBM2 Platform
백상현
2022-05
Divulge of Root Cause Failure in Individual Cells of 2x nm Technology DDR4 DRAM at Operating Temperature
백상현
2022-08
Quantification of Substrate Current Caused by an Individual Trap at Different Locations and Energies, Prevailing on Si/SiO2 Interface or Si Substrate of n-MOSFETs
백상현
2020-11
FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor
백상현
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double data Rate type 4 memory (D...
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