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COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)
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Results 11-20 of 20 (Search time: 0.004 seconds).
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Issue Date
Title
Author(s)
2012-00
Correlation of polishing pad property and pad debris on scratch formation during CMP
박진구
2005-11
Cu Oxide와 Silicon Tip 사이의 나노트라이볼러지 작용
박진구
2014-03
Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical-Mechanical Polishing
박진구
2014-02
Abrasive and additive interactions in high selectivity STI CMP slurries
박진구
2013-11
The impact of diamond conditioners on scratch formation during chemical mechanical planarization (CMP) of silicon dioxide
박진구
2008-07
The effect of hydrogen peroxide on frictional and thermal behaviors in a citric acid-based copper chemical mechanical planarization slurry
박진구
2013-04
Modification of Diamond Conditioner with V-SAM Coatings for Corrosion Prevention During Metal CMP
박진구
2013-05
Investigation of Source-Based Scratch Formation During Oxide Chemical Mechanical Planarization
박진구
2008-01
Effect of Corrosion Inhibitor, Benzotriazole, in Cu Slurry on Cu Polishing
박진구
2023-03-22
Effect of ammonium halide salts on wet chemical nanoscale etching and polishing of InGaAs surfaces for advanced CMOS devices
박진구
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박진구
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4
oxide slurry
4
TEOS removal rate
3
Pad debris
3
Scratch
2
conductivity
2
defect density
2
hydrogen peroxide
2
microscratch
2
pH of slurry
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regenerated slurry
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2020 - 2023
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2010 - 2019
12
2000 - 2009
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