Hanyang University repository
menu
검색
Library
Hanyang
Browse
Communities & Collections
Titles
Authors
My Repository
My Account
Receive email updates
Edit Profile
Repository at Hanyang University
Search
All of Repository
COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)
Articles
Theses (Master)
Theses (Ph.D.)
Start a new search
Current filters:
Title
Author
Subject
Date Issued
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Title
Author
Subject
Date Issued
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Title
Author
Subject
Date Issued
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Add filters:
Title
Author
Subject
Date Issued
Equals
Contains
ID
Not Equals
Not Contains
Not ID
Results/Page
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
Sort items by
Relevance
Title
Issue Date
In order
Ascending
Descending
Authors/record
All
1
5
10
15
20
25
30
35
40
45
50
Results 1-10 of 10 (Search time: 0.004 seconds).
Item hits:
Issue Date
Title
Author(s)
2004-02
Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance
박진구
2004-02
A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process
박진구
2004-11
Slurry에 첨가되는 pH 적정제가 Cu CMP에 미치는 영향 분석
박진구
2004-11
The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal
박진구
2004-07
CMP 공정중 전기화학적 방법과 마찰력을 이용하여 Cu Wafer와 Disc의 특성 비교
박진구
2004-07
In-Situ Characterization of Electrochemical and Frictional Behaviors During Copper CMP
박진구
2004-07
Cu CMP에서 Large sized particles이 연마속도에 미치는 영향
박진구
2004-06
The Effects of Mechanical Properties of Polishing Pads on Oxide CMP(Chemical Mechanical Planarization)
박진구
2004-06
레이저 충격파 클리닝 공정에 있어 자외선의 영향
박진구
2004-06
Reaction of Ozone and H2O2 in NH4OH Solutions and Their Reaction with Silicon Wafers
박진구
previous
1
next
Discover
-Subject
3
CMP
2
Cu CMP
1
Chemical mechanical planarization...
1
Chemical-Mechanical Planarization...
1
CLEANING SOLUTIONS
1
Complexing Agent
1
Computational Fluid Dynamics (CFD)
1
contact angles
1
Copper CMP
1
corrosion potential and current
next >
BROWSE
Communities & Collections
Titles
Authors