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COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)
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Results 31-40 of 88 (Search time: 0.002 seconds).
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Issue Date
Title
Author(s)
2009-10
Effect of Polysilicon Wettability on Polishing and Organic Defects during CMP
박진구
2009-10
Convective Assembly and Dry Transfer of Nanoparticles Using Hydrophobic/Hydrophilic Monolayer Templates
박진구
2004-00
The effect of additives in post-Cu CMP cleaning on particle adhesion and removal
박진구
2005-00
Cu post-CMP cleaning and the effect of additives
박진구
2005-03
핫 엠보싱용 점착방지막으로 사용되는 10 nm급 두께의 Teflon-like 박막의 형성 및 특성평가
박진구
2005-11
실험 계획법을 이용한 점착방지막용 플라즈마 증착 공정변수의 최적화 연구
박진구
2006-02
IPA 저온 접합법을 이용한 PMMA micro CE chip의 제작
박진구
2005-09
마이크로 구조물 형성을 위한 핫 엠보싱용 플라스틱 스탬프 제작
박진구
2005-07
부식방지제(BTA)가 첨가된 Cu CMP 슬러리에서의 연마거동과
박진구
2005-09
Ruthenium CMP에서 Cerium Ammonium Nitrate와알루미나 연마 입자가 연마 거동에 미치는 영향
박진구
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CMP
5
Cu CMP
3
adhesion force
3
AFM/LFM
3
Anti-stiction layer
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BTA
3
Chemical mechanical planarization...
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Etch rate
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Hot Embossing
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Nanoimprinting
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2009
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2003
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