| 2013-05 | Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance | 박진구 |
| 2020-02 | Hybrid DHF and N-2 jet spray cleaning for silicon nitride and metal layer DRAM patterns | 박진구 |
| 2020-02 | Hybrid DHF and N2 jet spray cleaning for silicon nitride and metal layer DRAM patterns | 박진구 |
| 2011-07 | Hydrophobic Modification of Diamond Conditioner for Prevention of Particle Adhesion During Oxide CMP | 박진구 |
| 2015-08 | Impact of the non-uniform intensity distribution caused by a meshed pellicle of extreme ultraviolet lithography | 박진구 |
| 2004-07 | In-Situ Characterization of Electrochemical and Frictional Behaviors During Copper CMP | 박진구 |
| 2017-10 | Influence of a wrinkle in terms of critical dimension variation caused by transmission nonuniformity and a particle defect on extreme ultraviolet pellicle | 박진구 |
| 2012-10 | Influence of anionic polyelectrolyte addition on ceria dispersion behavior for quartz chemical mechanical polishing | 박진구 |
| 2016-09 | Influence of non-uniform intensity distribution of deformed pellicle for N7 patterning | 박진구 |
| 2003-05 | Interaction Forces Between Silica Particles and Wafer Surfaces during Chemical Mechanical Planarization of Copper | 박진구 |
| 2006-06 | Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning | 박진구 |
| 2014-11 | Investigation of Cu-BTA complex formation and removal on various Cu surface conditions | 박진구 |
| 2016-10 | Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process | 박진구 |
| 2015-03 | Investigation of oxide layer removal mechanism using reactive gases | 박진구 |
| 2019-10 | Investigation of particle agglomeration with in-situ generation of oxygen bubble during the tungsten chemical mechanical polishing (CMP) process | 박진구 |
| 2008-12 | Investigation of physical cleaning process window by atomic force microscope | 박진구 |
| 2023-08 | Investigation of Selective Wet Etching of SiGe Substrates for High-Performance Device Manufacturing | 박진구 |
| 2013-05 | Investigation of Source-Based Scratch Formation During Oxide Chemical Mechanical Planarization | 박진구 |
| 2008-08 | Investigation of Surface Layer Formation for Fluorinated Carbon Film Using Fourier Transform Infrared Spectrometry Analysis | 박진구 |
| 2021-04 | Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning | 박진구 |
| 2006-02 | IPA 저온 접합법을 이용한 PMMA micro CE chip의 제작 | 박진구 |
| 2006-11 | Large scale directed assembly of nanoparticles using nanotrench templates | 박진구 |
| 2015-03 | Large-Scale Plasma Patterning of Transparent Graphene Electrode on Flexible Substrates | 박진구 |
| 2003-02 | Laser Shock Removal of Micro and Nanoscale Particles | 박진구 |
| 2005-07 | Laser Shock Removal of Nanoparticles from Si Capping Layer of Extreme Ultraviolet Lithography Masks | 박진구 |
| 2012-12 | Material removal mechanism of single and polycrystalline silicon in alkaline slurry | 박진구 |
| 2015-08 | Mechanical deflection of a free-standing pellicle for extreme ultraviolet lithography | 박진구 |
| 2021-02 | Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process | 박진구 |
| 2021-03 | Mechanisms of colloidal ceria contamination and cleaning during oxide post CMP cleaning | 박진구 |
| 2006-09 | Metal CMP 용 컨디셔너 디스크 표면에 존재하는 다이아몬드의 형상이 미치는 패드 회복력 변화 | 박진구 |
