Browsing "MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)" byAuthor박진구

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Showing results 109 to 138 of 263

Issue DateTitleAuthor(s)
2010-07Fabrication and Characterization of a 32 x 32 Array Digital Si-PIN X-ray Detector for a Single Photon Counting Image Sensor박진구
2012-03Fabrication of a hydrophobic/hydrophilic hybrid-patterned microarray chip and its application to a cancer marker immunoassay박진구
2005-11Fabrication of a Patterned Replica by Hot Embossing on Various Thicknesses of PMMA박진구
2014-12Fabrication of bumping mask for flip-chip process on stainless steel using through mask electrochemical micro machining(TMEMM)박진구
2018-04Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire박진구
2005-09Fabrication of Hot Embossing Plastic Stamps for Microstructure박진구
2016-10Fabrication of hydrophobic/hydrophilic switchable aluminum surface using poly(N-isopropylacrylamide)박진구
2012-02Fabrication of Large-Area CoNi Mold for Nanoimprint Lithography박진구
2005-06Fabrication of metal line on plastic substrate by hot embossing and CMP process박진구
2006-11Fabrication of nano- and micro-scale UV imprint stamp using diamond-like carbon coating technology박진구
2005-06Fabrication of plastic CE(capillary electrophoresis) microchip by hot embossing process박진구
2018-10Fabrication of Stainless Steel Metal Mask with Electrochemical Fabrication Method and Its Improvement in Dimensional Uniformity박진구
2007-11Fabrication of stainless steel mold using electro chemical fabrication (ECF) method for microfluidic biochip박진구
2008-06Fabrication of stainless steel mold using electrochemical fabrication method for microfluidic biochip박진구
2013-04Fluorocarbon film-assisted fabrication of a CoNi mold with high aspect ratio for nanoimprint lithography박진구
2021-02Formulation and Evaluation of Diluted Sulfuric-Peroxide-HF (DSP+) Mixtures for Cleaning High-Aspect Ratio Contacts in 3D NAND박진구
2011-02Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation박진구
2013-05Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance박진구
2020-02Hybrid DHF and N-2 jet spray cleaning for silicon nitride and metal layer DRAM patterns박진구
2020-02Hybrid DHF and N2 jet spray cleaning for silicon nitride and metal layer DRAM patterns박진구
2011-07Hydrophobic Modification of Diamond Conditioner for Prevention of Particle Adhesion During Oxide CMP박진구
2015-08Impact of the non-uniform intensity distribution caused by a meshed pellicle of extreme ultraviolet lithography박진구
2004-07In-Situ Characterization of Electrochemical and Frictional Behaviors During Copper CMP박진구
2017-10Influence of a wrinkle in terms of critical dimension variation caused by transmission nonuniformity and a particle defect on extreme ultraviolet pellicle박진구
2012-10Influence of anionic polyelectrolyte addition on ceria dispersion behavior for quartz chemical mechanical polishing박진구
2016-09Influence of non-uniform intensity distribution of deformed pellicle for N7 patterning박진구
2003-05Interaction Forces Between Silica Particles and Wafer Surfaces during Chemical Mechanical Planarization of Copper박진구
2006-06Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning박진구
2014-11Investigation of Cu-BTA complex formation and removal on various Cu surface conditions박진구
2016-10Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process박진구

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