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Showing results 1 to 30 of 32

Issue DateTitleAuthor(s)
2004-02A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process박진구
2003-02Adhesion and removal of silica and alumina slurry particles during Cu CMP process박진구
2019-06A Breakthrough Method for the Effective Conditioning of PVA Brush Used for Post-CMP Process박진구
2004-02Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance박진구
2004-07CMP 공정중 전기화학적 방법과 마찰력을 이용하여 Cu Wafer와 Disc의 특성 비교박진구
2004-07Cu CMP에서 Large sized particles이 연마속도에 미치는 영향박진구
2005-06The Deposition and Characterization of 10nm Thick Teflon-like Anti-stiction Films for the Hot Embossing박진구
2004-11The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal박진구
2004-06The Effects of Mechanical Properties of Polishing Pads on Oxide CMP(Chemical Mechanical Planarization)박진구
2005-10The Effects of pH Adjustors in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal박진구
2005-11Fabrication of a Patterned Replica by Hot Embossing on Various Thicknesses of PMMA박진구
2005-09Fabrication of Hot Embossing Plastic Stamps for Microstructure박진구
2005-06Fabrication of metal line on plastic substrate by hot embossing and CMP process박진구
2005-06Fabrication of plastic CE(capillary electrophoresis) microchip by hot embossing process박진구
2018-10Fabrication of Stainless Steel Metal Mask with Electrochemical Fabrication Method and Its Improvement in Dimensional Uniformity박진구
2004-07In-Situ Characterization of Electrochemical and Frictional Behaviors During Copper CMP박진구
2019-10Investigation of particle agglomeration with in-situ generation of oxygen bubble during the tungsten chemical mechanical polishing (CMP) process박진구
2003-02Laser Shock Removal of Micro and Nanoscale Particles박진구
2005-07Laser Shock Removal of Nanoparticles from Si Capping Layer of Extreme Ultraviolet Lithography Masks박진구
2005-10Nanoscale Particles Removal on an Extreme Ultra-Violet Lithography(EUVL) Mask Layer by Lasershock Cleaning박진구
2005-11Optimizing the Plasma Deposition Process Parameters of Antistiction Layers using a DOE(Design of Experiment)박진구
2005-07Particle Adhesion and Removal on EUV Mask Layers During Wet Cleaning박진구
2005-07Polishing Behavior and Characterization of Cu Surface in Citric Acid based Slurry with Corrosion Inhibitor(BTA)박진구
2019-01Post-CMP Cleaning of InGaAs Surface for the Removal of Nanoparticle Contaminants for Sub-10nm Device Applications박진구
2004-06Reaction of Ozone and H2O2 in NH4OH Solutions and Their Reaction with Silicon Wafers박진구
2005-09Ruthenium CMP에서 Cerium Ammonium Nitrate와 알루미나 연마 입자가 연마 거동에 미치는 영향박진구
2019-02Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning박진구
2019-05Selection of CVD Diamond Crystal Size on a CVD Pad Conditioner for Improved Lifetime박진구
2004-11Slurry에 첨가되는 pH 적정제가 Cu CMP에 미치는 영향 분석박진구
2019-08Study on possible root causes of contamination from an incoming PVA brush during post-CMP cleaning박진구