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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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Results 1-5 of 5 (Search time: 0.003 seconds).
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Issue Date
Title
Author(s)
2016-10
A peel adhesion study of electroless Cu layers on polymer substrates
김영호
2016-03
The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding
김영호
2016-08
Drop-shock reliability improvement of embedded chip resistor packages through via structure modification
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2016-02
Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x 5 0–43 wt%)
김영호
2016-03
Effects of Bath Composition on the Adhesion Characteristics of Electroless Cu Layers on Epoxy-Based Polymer Substrates
김영호
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RELIABILITY
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STRENGTH
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90 degrees peel test
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ACF
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adhesion
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ALLOY
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ANISOTROPIC CONDUCTIVE FILM
1
BARRIER LAYERS
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BRASS
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BUMPS
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