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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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Results 1-4 of 4 (Search time: 0.001 seconds).
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Issue Date
Title
Author(s)
2014-05
Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints
김영호
2014-08
Synthesis of Cu or Cu2O-polyimide nanocomposites using Cu powders and their optical properties
김영호
2014-02
Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D applications
김영호
2014-11
Synthesis of Dual Nanoparticles Embedded in Polyimide and Their Optical Properties
김영호
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nanocomposite
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NCP
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refractive index
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Reliability
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shear test
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Sn/Cu bumps
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T/C
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thin capping layer
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TSV
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ZnO
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