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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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Results 1-2 of 2 (Search time: 0.002 seconds).
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2018-01
Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications
김영호
2018-01
Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints
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brittle fracture
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Electroless nickel immersion gold
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fan-out package
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Flip chip self-alignment
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high-speed shear strength
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interfacial intermetallic compound
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Ni-P
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plating temperature
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reflow
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Sn-3.0Ag-0.5Cu
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