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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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2017-06
Process enabling highly accurate die position for fan-out package applications
김영호
2017-11
Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints
김영호
2017-11
Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment
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2017-11
Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments
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2017-12
Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu Microbumps
김영호
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Cu electroplating
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current-assisted bonding
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DIW rinse
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electromigration
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Epoxy-based dielectrics
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High-speed shear test
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Intermetallic compound
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